page 1 formosa ms chip zener diode 1 2 2 2 2 3 4~5 6 6 7 8 8 9 list list................................................................................................. package outline............................................................................... features.......................................................................................... maximum ratings ............................................................................. electrical characteristics................................................................... rating and characteristic curves........................................................ pinning information........................................................................... suggested solder pad layout............................................................. packing information.......................................................................... reel packing.................................................................................... suggested thermal profiles for soldering processes............................. high reliability test capabilities........................................................... mechanical data............................................................................... http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 zgfm306v8b thru zgfm30200b document id issued date revised date revision page. ds-121741 2009/08/10 2011/07/01 d 9
package outline page 2 3.0w surface mount zener diodes - 6.8v-200v parameter conditions symbol v f p d min. typ. max. 1.20 3.0 unit v w storage temperature range operating junction temperature range t stg t j -55 -65 +150 +175 o c o c maximum ratings (at t =25 c unless otherwise noted) a o forward voltage power dissipation i = 200 ma f formosa ms chip zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 mechanical data epoxy:ul94-v0 rated flame retardant case : molded plastic, terminals : solder plated, solderable per mil-std-750, method 2026 polarity : indicated by cathode band mounting position : any weight : 0.09 gram ? ? ? ? ? ? do-214aa / smb approximated 0.213(5.4) 0.197(5.0) 0.016(0.4) typ. 0.142(3.6) 0.126(3.2) 0.075(1.9) 0.067(1.7) 0.032 (0.8) typ. 0.032(0.8) typ. dimensions in inches and (millimeters) smb batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. glass passivated chip junction. standard zener voltage tolerance 5%. low inductance. low profile package. built-in strain relief. lead-free parts meet environmental standards of mil-std-19500 /228 features suffix "-h" indicates halogen-free part, ex.zgfm306v8b-h. ? ? ? ? ? ? ? ? document id issued date revised date revision page. zgfm306v8b thru zgfm30200b t=50 c l thermal characteristics parameter symbol unit limit c/w typical thermal resistance junction to ambient r ja 85 ds-121741 2009/08/10 2011/07/01 d 9 note 1 mounted on fr-4 pcb .
page 3 note : 5% tolerance of zener voltage for suffix "b" ex: zgfm306v8b is 6.8v 5% formosa ms chip zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 electrical characteristics (at t =25 c unless otherwise noted) a o marking code zener voltage te s t current zener impedance leakage current ma i zt z@ i zt zt max. ma i zk max.(ua) i r volts v r z@ i zk zk 7.14 7.88 8.61 9.56 10.50 11.55 12.60 13.65 15.75 16.80 18.90 21.00 23.10 25.20 28.35 31.50 34.65 37.80 40.95 110 100 91 85 82 75 68 63 58 50 47 42 37 34 31 28 25 23 21 2.0 2.0 2.0 3.0 4.0 4.0 4.5 5.0 7.0 8.0 10.0 11.0 12.0 13.0 18.0 20.0 23.0 25.0 3z6v8 3z7v5 3z8v2 3z9v1 3z10 3z11 3z12 3z13 3z15 3z16 3z18 3z20 3z22 3z24 3z27 3z30 3z33 3z36 3z39 1.00 0.50 0.50 0.50 0.50 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 5.0 3.0 3.0 1.0 1.0 0.5 4.0 5.0 6.0 7.0 7.6 8.4 9.1 9.9 11.4 12.2 13.7 15.2 16.7 18.2 20.6 22.8 25.4 27.4 29.7 700 700 700 700 700 700 700 700 700 700 750 750 750 750 750 1000 1000 1000 part no. zgfm306v8b zgfm307v5b zgfm308v2b zgfm309v1b zgfm3010b zgfm3011b zgfm3012b zgfm3013b zgfm3015b zgfm3016b zgfm3018b zgfm3020b zgfm3022b zgfm3024b zgfm3027b zgfm3030b zgfm3033b zgfm3036b zgfm3039b 45.15 49.35 53.55 58.80 65.10 71.40 19 17 16 15 13 12 30.0 35.0 40.0 48.0 55.0 75.0 3z43 3z47 3z51 3z56 3z62 3z68 0.25 0.25 0.25 0.25 0.25 0.25 32.7 35.8 38.8 42.6 47.1 51.7 1500 1500 1500 2000 2000 2000 zgfm3043b zgfm3047b zgfm3051b ZGFM3056B zgfm3062b zgfm3068b 78.75 86.10 95.55 105.0 11 10 8.2 7.5 90.0 100 125 175 3z75 3z82 3z91 3z100 0.25 0.25 0.25 0.25 56.0 62.2 69.2 76.0 2000 3000 3000 3000 zgfm3075b zgfm3082b zgfm3091b zgfm30100b nom. v@ i zzt (volts) 6.8 7.5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 100 min. 6.46 7.13 7.79 8.65 9.50 10.45 11.40 12.35 14.25 15.20 17.10 19.00 20.90 22.80 25.65 28.50 31.35 34.20 37.05 40.85 44.65 48.45 53.20 58.90 64.60 71.25 77.90 86.45 95.00 115.5 126.0 136.5 6.8 6.3 5.8 250 325 400 3z110 3z120 3z130 0.25 0.25 0.25 83.6 91.2 98.8 4000 4500 5000 zgfm30110b zgfm30120b zgfm30130b 157.5 168.0 189.0 210.0 5.0 4.7 4.2 3.7 575 650 725 900 3z150 3z160 3z180 3z200 0.25 0.25 0.25 0.25 114.0 121.6 136.8 152.0 6000 6500 7000 8000 zgfm30150b zgfm30160b zgfm30180b zgfm30200b 110 120 130 150 160 180 200 104.50 114.00 123.50 142.50 152.00 171.00 190.00 9.14 2.0 3z8v7 0.50 4.0 6.6 700 zgfm308v7b 8.7 8.27 9.1 60.0 1500 5.0 5.0 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 document id issued date revised date revision page. zgfm306v8b thru zgfm30200b ds-121741 2009/08/10 2011/07/01 d 9 max . () max . ()
page 4 fig.1 typical thermal response l fig. 2 maximum surge power fig.4 units to 12 volts fig 5. units 10 to200 volts nominal vz, (v) rating and characteristic curves (zgfm306v8b thru zgfm30200b) http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 0.0001 0.0002 0.0005 0.001 0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 2 5 10 note below 0.1 second, thermal response curve is applicable to any lead length(l) d=0 0.01 0.02 0.05 0.1 0.2 d=0.5 30 20 10 7 5 3 1 0.7 0.5 0.3 duty cycle, d=t1 t2 ppk t1 t2 single pulse tjl=jl(t)ppk repetitive lulses tjl=jl(t,d)ppk r jl ( t,d )transient thermal resistance junction-to-lead ( c / w ) 100 10 1.0 0.1 500 250 150 100 50 30 20 10 ppk, peak surge power, ( w ) pw, pulse width, (ms) rectangular nonrepetitive waveform tj=25 c prior to initial pulse 1k 500 200 1 2 5 10 20 100 50 0.0001 0.0002 0.001 0.002 0.005 0.02 0.03 0.05 0.1 ir, reverse leadage, (uadc) @vr as specified in elec. char. table 0.0003 0.0005 0.003 0.01 fig. 3 maximum surge power document id issued date revised date revision page. ds-121741 2009/08/10 2011/07/01 d 9 v mv/ c
page 5 fig.6 to 10 volts rating and characteristic curves (zgfm306v8b thru zgfm30200b) http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 fig. 8 typical thermal resistance fig.7 vz = 12 thru 82 volts document id issued date revised date revision page. ds-121741 2009/08/10 2011/07/01 d 9 fig.9 steady state power derating p , maximum power dissipation, (w) d t , lead temperature, ( c) l o 40 . 35 . 30 . 25 . 20 . 15 . 10 . 05 . 0 0 25 50 75 100 125 150
pinning information 1 2 pin1 cathode pin2 anode pin simplified outline symbol page 6 2 1 suggested solder pad layout formosa ms chip zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 dimensions in inches and (millimeters) a c b b 0.059 (1.50) a 0.142 (3.60) c 0.118 (3.00) package smb document id issued date revised date revision page. zgfm306v8b thru zgfm30200b ds-121741 2009/08/10 2011/07/01 d 9
page 7 packing information p 0 p 1 e b d f w p a d d 1 d 2 w 1 c t formosa ms chip zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 item tolerance smb carrier width carrier length carrier depth sprocket hole 13" reel outside diameter 7" reel outside diameter 13" reel inner diameter 7" reel inner diameter feed hole diameter sprocket hole position punch hole position punch hole pitch sprocket hole pitch embossment center reel width overall tape thickness tape width p 0 p 1 e b c d f t w p a d d d 1 d 1 d 2 w 1 symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 unit:mm 1.50 330.00 178.00 50.00 62.00 13.00 1.75 5.50 8.00 4.00 2.00 0.23 12.00 18.00 note:devices are packed in accor dance with eia standar rs-481-a and specifications listed above. 3.81 5.74 2.24 document id issued date revised date revision page. zgfm306v8b thru zgfm30200b ds-121741 2009/08/10 2011/07/01 d 9
page 8 formosa ms chip zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 reel packing smb 4,000 8.0 8,000 337*337*37 330 382*356*392 88,000 17.0 package reel size reel component spacing box inner box reel dia, carton size carton approx. gross weight (kg) (pcs) (m/m) (m/m) (m/m) (pcs) (m/m) (pcs) 13" document id issued date revised date revision page. profile feature soldering condition average ramp-up rate(t to t ) <3 /sec preheat -temperature min(tsmin) 150 -temperature max(tsmax) 200 -time(min to max)(t ) 60~120sec tsmax to t -ramp-uprate <3 /sec time maintained above: -temperature(t ) 217 -time(t ) 60~260sec peak temperature(t ) 255 0/ 5 time within 5 of actual peak temperature(t ) ramp-down rate <6 /sec time 25 to peak temperature <6minutes lp s l l l p p o o o o o oo o o o c c c c c c- + c c c c 3.reflow soldering 10~30sec 1.storage environment: temperature=5 ~40 humidity=55%25% 2.reflow soldering of surface-mount devices oo cc suggested thermal profiles for soldering processes critical zone tl to tp critical zone tl to tp tl tsmax tsmin ramp-up tp ts preheat t25 c to peak o time 25 tl tp ramp-down temperature zgfm306v8b thru zgfm30200b ds-121741 2009/08/10 2011/07/01 d 9
page 9 formosa ms chip zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. zgfm306v8b thru zgfm30200b ds-121741 2009/08/10 2011/07/01 d 9 high reliability test capabilities 1. solder resistance 2. solderability 3. high temperature reverse bias 4. pressure cooker 5. temperature cycling 6. humidity 7. high temperature storage life at 260 5 for 10 2sec. at 245 5 for 5 sec. v = 80% at t =150 for 168 hrs. 15p at t =121 for 4 hrs. -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles. at t =85 , rh=85% for 1000hrs. at 175 for 1000 hrs. c c v nom* c c cc c c o o o o oo o o zj sig a a z mil-std-750d method-2031 mil-std-202f method-208 mil-std-750d method-1038 jesd22-a102 mil-std-750d method-1051 mil-std-750d method-1021 mil-std-750d method-1031 item test conditions reference
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